Methods for planarizing a semiconductor contactor

ABSTRACT

A planarizer for a probe card assembly. A planarizer includes a first control member extending from a substrate in a probe card assembly. The first control member extends through at least one substrate in the probe card assembly and is accessible from an exposed side of an exterior substrate in the probe card assembly. Actuating the first control member causes a deflection of the substrate connected to the first control member.

CROSS-REFERENCE TO RELATED APPLICATION(S)

This application is a division of U.S. patent application Ser. No.09/527,931, filed Mar. 17, 2000 (pending). The foregoing U.S. patentapplication Ser. No. 09/527,931 is incorporated herein by reference inits entirety.

BACKGROUND OF THE INVENTION

1. Field of the Invention

The present invention relates generally to a probe card assembly, andmore specifically to achieving a more planar relationship between thecontact elements on a probe card assembly and a device under test.

2. Background Information

Individual semiconductor devices (dies) are typically produced bycreating several identical devices on a semiconductor wafer, usingcommonly known techniques such as photolithography and deposition.Generally, these processes are intended to create fully functionalintegrated circuit devices, prior to separating the individual dies fromthe semiconductor wafer. However, physical defects in the wafer anddefects in the processing of the wafer often lead to the presence ofsome defective dies on the wafer. it is desirable to be able to identifythe defective dies prior to packaging or prior to their separation formthe wafer. To perform such identification, wafer testers or probers areused to make pressure connections to connection pads (bond pads) on thedies. The dies can then be tested for defects. A conventional componentof a wafer tester is a probe card which has contact elements that effectthe pressure connections to the bond pads of the dies.

A probe card can be part of a probe card assembly, such as that which isdescribed in U.S. Pat. No. 5,974,662, titled “Method of Planarizing Tipsof Probe Elements of a Probe Card Assembly,” which is incorporated byreference herein. A probe card assembly according to U.S. Pat. No.5,974,662 typically includes a number of components in addition to theprobe card itself, such as in interposer and a space transformer. Theinterposer is disposed between the probe card and the space transformerand allows the orientation of the space transformer to be adjustedrelative to the orientation of the probe card.

The space transformer permits a plurality of contact structures on oneside of the space transformer to make contact with the terminals of anelectronic component (e.g. bond pads on a semiconductor device) at arelatively fine pitch, while connections to another side of the spacetransformer are made at a relatively coarser pitch. In a preferredembodiment, the contact structures make contact with an activesemiconductor device, such as a wafer. Such connections can be disruptedby slight variations in the planarity of the space transformer.Unfortunately, variations in the planarity of the space transformer canoccur, for example, when the space transformer is manufactured. Forexample, an edge of the space transformer might be bent slightly or thecenter of the space transformer might be bowed.

FIG. 1 illustrates generally a prior art technique for adjusting theorientation of a space transformer. A space transformer 110 is shownwith different sets of adjustment points on the bottom of spacetransformer 110. In one example, the adjustment points correspond to thelocations of ball bearings that can be pressed against a back surface ofspace transformer 110 to adjust the orientation of space transformer110. In FIG. 1, three adjustment points 112 a-112 c are used to adjustthe orientation of space transformer 110. Adjustment points 112 a-112 care located along the periphery of space transformer 110.

The adjustment points shown in FIG. 1 can be used to deflect peripheralareas of space transformer 110, but hey cannot be used to deflectnon-peripheral areas, such as the center, of space transformer 110. Thethree points of adjustment shown in FIG. 1 define a plane which isapproximately parallel to the plane of a front surface of spacetransformer 110. However, because there are only three adjustmentpoints, they can adjust the orientation, but not the shape, of spacetransformer 110; geometric changes are made on only a low order (1^(st)order polynomial). Furthermore, using ball bearings in conjunction withthe adjustment points provides for the application of only a pushingforce against space transformer 110, and in some instances, the pushingforce is opposed by a spring member on an opposite side of spacetransformer 110.

In many instance, it is desirable to be able to apply a pulling orpushing force at a multiplicity of locations on a space transformerbecause the space transformer may require deflection or distortion overits surface to achieve better planarity and correct surface variations.

SUMMARY OF THE INVENTION

The present invention provides, in one embodiment, a method of adjustingthe planarity of a substrate in a probe card assembly, in which themethod includes deflecting at least one of a first area of thesubstrate, a second area of the substrate, a third area of thesubstrate, and a fourth area of the substrate, and the deflectingincludes applying a pulling force to at least one of the first, second,third and fourth areas of the substrate.

The present invention provides, in another embodiment, a method ofachieving a degree of planarity among contact portions of a plurality ofcontact structures mounted to a substrate, in which the method includescreating the substrate with the plurality of contact structuresconnected to a first surface of the substrate, the contact portions ofthe contract structures having a first planar relationship relative toone another, and applying a plurality of forces selectively to thesubstrate to deform the substrate and achieve a second planarrelationship of the contact portions of the contact structures relativeto one another

Additional features and benefits of the present invention will becomeapparent upon review of the following description.

BRIEF DESCRIPTION OF THE DRAWINGS

Various embodiment of the present invention will be described in detailwith reference to the following drawings in which like referencenumerals refer to like elements. The present invention is illustrated byway of example and not limitation in the accompanying figures. It shouldbe noted that many of the features shown in the figures have not beendrawn to scale for the purpose of better illustrating such features.

FIG. 1 illustrates generally a prior art technique for adjusting theplanarity of a space transformer in a probe card assembly.

FIG. 2 illustrates a cross-sectional view of a probe card assembly inaccordance with the teachings of the present invention.

FIGS. 3A and 3B illustrate generally deflections of a substrate in aprobe card assembly in accordance with the teachings of the presentinvention.

FIG. 4A illustrated a bottomview of a probe card assembly in accordancewith the teachings of the present invention.

FIG. 4B illustrates a bottomview of a substrate in the probe cardassembly shown in FIG. 4A.

FIGS. 5A-5C illustrate different embodiments of a planarizing elementfor a probe card assembly in accordance with the teachings o the presentinvention.

FIG. 6 illustrates multiple adjustable substrates of a probe cardassembly.

FIG. 7A illustrates a top view of a multiple substrate assembly inaccordance with the teachings of the present invention.

FIG. 7B illustrates a side view of the multiple substrate assembly shownin FIG. 7A.

DETAILED DESCRIPTION

The following description provides embodiments of the present invention.However, it will be appreciated that other embodiments of the presentinvention will become apparent to those of ordinary skill in the artupon examination of this description. Thus, the present description andaccompanying drawings are for purposes of illustration and are not to beused to construe the invention in a restrictive manner.

In a preferred embodiment of the present invention, a probe cardassembly includes a probe card, an interposer, a space transformer, adrive plate and a first control member. The interposer is locatedbetween the probe card and the space transformer. The drive plate islocated adjacent to the probe card. A protrusion extends from a centralarea of the bottom surface of the space transformer and through athrough hole in the interposer. The first control member is coupled tothe protrusion and is disposed within the through hole in the interposerand through holes in the probe card and drive plate. The first controlmember has an actuating component rotatably coupled to an end of thefirst control member that is accessible from an exposed side of thedrive plate. A spring is supported by the actuating component to beurged against the drive plate. As the actuating component is rotated andmoved toward the drive plate, the spring is pressed against the driveplate and provides a resistance to the movement of the actuatingcomponent. During this time, the space transformer is pulled toward theinterposer via the first control member coupled to the protrusionextending from the space transformer. Thus, a non-peripheral area of thespace transformer is deflected according to a preferred embodiment ofthe present invention.

FIG. 2 illustrates a side cross-sectional view of a probe card assembly200 in accordance with the teachings of the present invention. A spacetransformer 210 is held down at its periphery by a clamping frame 212.The top of space transformer 210 may be substantially flush with the topof frame 212 such that a plurality of resilient contact structures 211extending from the top of space transformer 210 can extend above the topsurface of frame 212.

Contact structures 211 each have a contact region for making contactwith the terminals of an electronic component (e.g. bond pads on asemiconductor device). In one embodiment, contact structures 211 arefreestanding, springable contact elements. It is appreciated that othercontact elements can be used in place of contact structures 211. It ispreferred that such elements are sufficiently coupled to spacetransformer 210 to benefit from the planarizing action associated withthe present invention. For example, posts, pins, pads, terminals andbumps/balls or other contact elements known in the art can be used ascontact elements.

A clamping spring 214 (e.g. leaf spring) is couple to a frame 218 byscrews 216. Spring 214 secures frame 212. A printed wiring board 220,such as probe card, is located beneath frame 218 and has a through holein its center and through holes at points around the center in a regularpattern. A drive plate 222, which can also act as a stiffeningsubstrate, is coupled to the bottom of board 220. Drive plate 222 has aset of through holes which align with the through holes in board 220.Screws 224 are placed in the outer through holes in both board 220 anddrive plate 222. Ball bearings 226 rest on an end of screws 224 and arepressed against space transformer 210 when screws 224 are screwed towardspace transformer 210.

An interposer 230 is located between space transformer 210 and board220. Interposer 230 has a central through hole. Resilient contactstructures 229 extend from the top of interposer 230 and effect pressureconnections with contact pads 228 located on space transformer 210.Resilient contact structures 231 extend from the bottom of interposer230 and effect pressure connections with contact terminals 234 locatedon board 220. A threaded protrusion or stud 238 extends from the bottomof space transformer 210. Stud 238 may be coupled to space transformer210 or integrally formed with space transformer 210. An extension stud24C has a threaded bore in one end which is screwed onto stud 238. Theother end of stud 240 is threaded and accommodates an actuating nut 242.Stud 240 is disposed through the central through holes of interposer230, board 220 and drive plate 222. A spring element 244 (e.g.Belleville washer) is supported by nut 242 and is pressed against driveplate 222 as nut 242 is moved up stud 240.

It is appreciated that a plurality of resilient contact structures canbe provided on the bottom surface of a space transformer (e.g.fabricated on the terminals on the bottom surface of a spacetransformer) to make direct contact to the terminals on the top surfaceof a printed wiring board. Thus, the use of an interposer is optional.One alternative to an interposer is a semi-rigid support member thatbacks a flexible sheet incorporating contact structures. The semi-rigidsupport member, and hence the flexible sheet and contact structures, canbe planarized in accordance with the teaching of the present invention.Other alternatives to an interposer include flex tape, pogo pins andother socket or interconnect constructions.

More detailed discussion of printed wiring boards (e.g. probe cards),interposers, space transformers, drive plates, resilient contactstructures, contact elements and other components of a probe cardassembly that can be used in conjunction with the present invention canbe found in U.S. Pat. No. 5,974,662, U.S. patent application Ser. No.08/920,255, titled “Making Discrete Power Connections to a SpaceTransformer of a Probe Card Assembly,” now U.S. Pat. No. 6,050,829, andU.S. patent application Ser. No. 09/042,606, titled “Probe Card Assemblyand Kit” now U.S. Pat. No. 7,064,566, all of which are incorporated byreference herein.

The planarity of space transformer 210 can be adjusted via peripheralcontrol members (e.g. screws 224 and ball bearings 226) and anon-peripheral control member (e.g. stud 240 coupled to stud 238).

For example, screws 224 can be accessed from the bottom side of driveplate 222 to drive them upward and force ball bearings 226 against spacetransformer 210. Because space transformer 210 is held by frame 212 andspring 214, the contact of ball bearings 226 against space transformer210 subjects space transformer 210 to compressive forces. Thus, whenball bearings 226 are pressed against space transformer 210, spacetransformer 210 deflects accordingly. Because ball bearings 226 arelocated near the periphery of space transformer 210, only peripheralareas of space transformer 210 are adjusted via screws 224 and ballbearings 226. Furthermore, because screws 224 are accessible from anexposed side of drive plate 222, the planarity of peripheral areas ofspace transformer 210 is remotely adjustable. It should be noted thatscrews 224 and ball bearings 226 can be used to deflect spacetransformer 210 without interfering with interposer 230.

A central area of space transformer 210 can be deflected through theactuation of nut 242. As nut 242 is turned and moves up extension stud240, spring element 244 is pressed against drive plate 222 by nut 242.Spring element 244 provides a resistance to the upward movement of nut242. Thus, as nut 242 is turned around the threads of stud 240 and urgedagainst spring element 244, stud 240 is pulled down. Because stud 240 iscoupled to stud 238, the area of space transformer 210 where stud 238 islocated is also pulled down along with stud 240. Thus, such area ofspace transformer 210 is subjected to a pulling force or tensile force.If space transformer 210 is bowed (e.g. domed), then stud 240 can bepulled down through the actuation of nut 242 to adjust the planarity ofspace transformer 210. It should be noted that because nut 242 isaccessible from an exposed side of drive plate 222, the planarity of anon-peripheral area of space transformer 210 is remotely adjustable. Itshould be further noted that studs 238 and 240 can be used to deflectspace transformer 210 without interfering with interposer 230.

Stud 238 can be located at a variety of positions on the bottom surfaceof space transformer 210. For example, stud 238 can be located near thecenter or the edge of the bottom surface of space transformer 210. Thus,it is appreciated that the planarizing apparatus of the presentinvention can be used to deflect peripheral areas, as well asnon-peripheral areas, of a substrate in a probe card assembly.Furthermore, multiple studs can be used. A space transformer can beconfigured to use a system in which as many as all of the studs or otherelements fixed to the space transformer provide pushing and pullingforces through an actuating mechanism to effect the desired deformationof a surface of the space transformer.

Screws 224 and ball bearings 226 cannot be used to pull down a centralarea of space transformer 210 because they are configure to functionwith an opposing spring against space transformer 210. The planarizingapparatus of the present invention addresses such a deficiency asdescribed above. Thus, the planarity of space transformer 210 can bemore thoroughly adjusted, particularly on a higher order of adjustment(e.g. 2^(nd) order polynomial, 3^(rd) order polynomial, etc.), with theplanarizing apparatus of the present invention.

In addition to being able to adjust the planarity of space transformer210, the planarizing apparatus of the present invention can be used todeflect space transformer 210 such that the contact regions of contactstructures 211 are planarized relative to one another. The planarizationof the contact regions of contact structures 211 allows more uniformcontact to be made with the terminals of an electronic component tofacilitate testing of the electronic component. Furthermore, thedeflection of space transformer 210 can effect more uniform contactbetween contact pads 228 and contact structures 229, and betweenterminals 234 and contact structures 231.

FIGS. 3A and 3B illustrate generally a bowed substrate 310, such as aspace transformer, which is typically located in a probe card assembly.If substrate 310 is bowed as shown in FIG. 3A then a fore 332 (e.g.tensile force) which does not directly affect an adjacent interposer 330can be applied to substrate 310 to pull substrate 310 into a desiredposition. Specifically, a central area of substrate 310 can be deflectedto a desired planarity. Such a pulling force can be applied aspreviously described in conjunction with FIG. 2. If substrate 310 isbowed as shown in FIG. 3B, then a force 334 (e.g. compressive force)which does not affect interposer 330 can be applied to substrate 310 topush substrate 310 into a desired position. Specifically, a central areaof substrate 310 can be deflected to a desired planarity. Such a pushingforce can be applied using an embodiment of the present invention asshown in FIG. 5C.

FIG. 4A illustrates a bottomview of a probe card assembly fitted withpush-only control members 424, which are similar to screws 224, and apush-pull control member 440, which is similar to extension stud 240. Adrive plate 422 is coupled to a probe card 420. Both drive plate 422 andprobe card 420 have through holes to accommodate control members 424 and440. Control members 424 drive ball bearings 426 at correspondinglocations of a substrate 410, as shown in FIG. 4B. Substrate 410, suchas a space transformer, is typically part of a probe card assembly suchas that shown in FIG. 2. A stud 428 extending from the surface ofsubstrate 410 is coupled to central control member 440 to allow acentral area of substrate 410 to be deflected by the actuation of a nut442 relative to control member 440. Control members 424 and 440 can bedrive independently to adjust the planarity of substrate 410 in avariety of ways.

FIGS. 5A-5C illustrate various embodiments of a planarizing apparatusaccording to the present invention. In FIG. 5A, a substrate 510, such asa space transformer, has a stud 538 a coupled to or integrally formedwith the bottom surface of substrate 510. Stud 538 a has a threaded boreto accommodate a connector 540 a having threaded ends. A nut 542 coupledto one of the threaded ends of connector 540 a supports a spring element544 a, which can be pressed against a substrate (not shown), such as adrive plate, in a manner similar to that described in conjunction withFIG. 2. The actuation of nut 542 relative to connector 540 a and theresulting resistance provided by spring element 544 a help driveconnector 540 a down, thereby deflecting substrate 510. Spring element544 a is shown as a Belleville washer. It is appreciated that othersprings elements, such as coil springs and wavy washers could be used inlieu of a Belleville washer. Furthermore, the spring element could bebuilt into the bottom of the drive plate.

In FIG. 5B, substrate 510 has a threaded stud 539 b coupled to orintegrally formed with the bottom surface of substrate 510. A connector540 b with a threaded bore is coupled to stud 538 b. A nut 542 coupledto a threaded end of connector 540 b supports spring elements 544 b-544d against a substrate (not shown), such as a drive plate. Differentspring elements can be used as spring elements 544 b-544 d to providevarying resistances to nut 542 as nut 542 is twisted along the threadsof connector 540 b toward space transformer 510.

In FIG. 5C, substrate 510 has a threaded stud 538 c coupled to orintegrally formed with the bottom surface of substrate 510. A connector540 c with a threaded bore is coupled to stud 539 c. A threaded end ofconnector 540 c is coupled to a threaded through hole in a substrate522, such as drive plate. Connector 540 c is accessible from an exposedside of substrate 522, which is typically an exterior substrate of aprobe card assembly. Connector 540 c can be turned clockwise orcounter-clockwise to deflect substrate 510 in opposite directions.

It should be noted that a multipoint adjustment scheme according to thepresent invention can also be used to modify the orientation (e.g. in x,y and θ directions) of a substrate in a probe card assembly with respectto other substrates in the assembly without interfering with theplanarity or orientation of such other substrates. Accordingly, a probecard assembly having multiple deformable substrates may be constructedand made planar across the surface defined by their contact elementswith respect to a test substrate, while appropriate positions of thecontact elements from substrate to substrate are maintained. Such anassembly is shown generally in FIG. 6.

Multiple substrates 610, 620 . . . n are located adjacent to one anotherin a combined assembly. Each substrate is adjustable with respect to theother substrates in x, y and θ using orienting mechanisms (not shown)well known in the art. A system for deforming substrates in the zdirection (out of the page) is also included but is not shown. Such asystem may incorporate planarizing elements as disclosed herein. Thevector r defines the relationship between corresponding contact elements610 a, 620 a . . . z on multiple substrates 610, 620 . . . n,respectively. Substrates 610, 620 . . . n are positioned with respect toone another such that r is within a desired degree of accuracy, anddeformed such that the contact tips of contact elements 610 a, 620 a . .. z are coplanar within a desired degree of accuracy in the z direction.

Referring to FIGS. 7A and 7B, which provide more detailedrepresentations of a combined assembly having multiple substratessimilar to that shown in FIG. 6, contact elements 711 are secured toinsulating support member 705. Contact elements 711 are electricallyconnected by trances 706 to connecting wires 715, which are connected inturn to traces 713 and to tester 760. Contact elements 711 areillustrated as solder balls but of course can take many of the formsdescribed herein. In one preferred embodiment, connecting wires 715 areportions of a multi-stranded flex cable. In another preferredembodiment, connecting wires 715 can be wirebonded connections. In stillanother preferred embodiment, insulating support member 705 ispolyimide, or other flex materials well known in the art.

Substrate 704 supports insulating support member 705. In one preferredembodiment, they are secured together. In another preferred embodiment,they can be in close contact, but can move relative to each other.Substrate 704 is positioned by a push-only control element comprisingactuator 730 acting on element 724 and ball 726 to press againstsubstrate 704, opposed by spring 712, which in turn is secured tosubstrate frame 720. Several of these push control elements can be used;two are shown in FIG. 7B for illustrative purposes. Substrate 704 alsois positioned by a push-pull control element comprising actuator 732,element 740, and stud 738, which is secured to substrate 704. Substrateframe 720 is secured to substrate housing 722, which in turn isconnected to actuators 730, 732, forming a closed loop system. Byselectively positioning the actuators, the shape of substrate 704 can becontrolled.

Printed wiring board 750 supports housing 752, which is connected topositioning element 756, which in turn is connected to substrate housing722 directly or, as shown, through bridge housing 754. Positioningelement 756 is illustrated in stylized form and can include elements asdesired to provide x, y, z, and three degrees of positional control oversubstrate housing 722.

FIG. 7B illustrates a second substrate 704 a as well, with elements asdescribed above. Each substrate 704, 704 a can be adjusted to a desireddegree of planarity. Equally well, each substrate 704, 704 a can beadjusted to a desired degree of flatness of the contact region portionof each of contact elements 711. Moreover, substrates 704 and 704A canbe positioned relative to each other to provide a relatively large arrayof contact elements 711.

Such a probe card assembly constructed of multiple deformable substratesis functionally equivalent to a larger probe card assembly having a muchlarger (equivalent in area) single substrate. It is important to notethat deformation of the monolithic substrate in order to change thespatial relationship of the contact elements residing on it is achievedboth by deformation and x, y, z and θ movement of the multiplesubstrates and supporting structures in which they reside.

The planarizing apparatus of the present invention can be manuallyactuated or automatically actuated. For example, an actuator mechanismcan be connected to a planarizing apparatus (e.g. to the actuating nut)and operated according to signals from a computer system. A greaternumber of control points driven by such automated planarizingapparatuses can shape a substrate to a higher degree of accuracy.

Although the present invention has been described with particularreference to probe card assemblies and space transformers in particular,it is appreciated that the present invention is not so limited in itsapplications.

In the foregoing detailed description, the apparatus and method of thepresent invention have been described with reference to specificexemplary embodiments. However, it will be evident that variousmodifications and changes may be made without departing from the broaderscope and spirit of the present invention. The present specification andfigures are accordingly to be regarded as illustrative rather thanrestrictive.

1. A method of adjusting the planarity of a substrate in a probe cardassembly, the method comprising: deflecting at least one of a first areaof the substrate, a second area of the substrate, a third area of thesubstrate, and a fourth area of the substrate; said deflectingcomprising applying a pulling force to said at least one of said first,second, third, and fourth areas of the substrate. 2-10. (canceled)